Application of Laser Direct Writing Technology in Silicon Photonics
2024-07-04 17:08
Industry background:
With the increasing demand for Internet applications, such as machine learning, VR/AR, live broadcasting, etc., faster and faster computing power and communication speeds are required, which will be reflected in the chip. Traditional chip transmission uses copper wires, and copper-electric interconnection will generate ohmic loss and heat. Limited by bandwidth and power consumption, copper-electric interconnection is getting closer and closer to the physical limit. One solution is to pursue physically higher advanced processes, and the other is to replace electricity with light. The high frequency and high potential bandwidth of light can improve Ohm's law and achieve lower power consumption and higher transmission speed.
Application areas:
At present, optical communication has developed very rapidly, from trunk transmission in the 1990s to optical interconnection of data center LANs after 2000. Current research is mainly on optical interconnection between boards and optical interconnection within chips. Compared with traditional electronic chips, photonic chips will achieve a great breakthrough in performance bottlenecks. With the maturity of photonic chip technology and the further reduction of chip packaging costs, photonic chips will move from large devices such as servers, large data centers, and supercomputers to small mobile devices such as robots, PCs, and mobile phones, and their application areas and application scenarios will be greatly expanded.