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Features and characteristics
▎ INDEX applies the technology cultivated in crystal blank bonders to make devices compact and assemble high-performance components.
▎ High-precision assembly is achieved by measuring the position of substrates/components, correcting their positions, and assembling them through image processing.
▎ The dispensing amount and status are checked through image processing to minimize the outflow of product defects.
▎ Use a laser displacement meter to measure substrate height to minimize irregular variations in dispensing quality.
Application Scenario
▎ In addition to MEMS sensors, we can also assemble small electronic devices such as capacitors, LEDs, human sensors, and photoelectric sensors.
▎ We will design according to customer's requirements. Please contact us.