- Details
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- Commodity name: AFM-15
- 品名2: Flip Chip Bonders
Features and characteristics
Improve ultrasonic efficiency and enable products to be joined at low temperature and in a short time, thereby avoiding mechanical thermal residual pressure on the products and achieving stable and high-quality welding.
Application Scenario
Depending on the parts and products, load/ultrasonic heads can be selected and are suitable for TCXO, SAW filter, LED, C-MOS, etc.
Wafers up to 12 inches can be processed.
Contact Us
Address: Pangnan Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province 01, Building 17, MAX Science Park, 998
Fax: 86-0512 6301 9422
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