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UTC-RZ1

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SHINKAWA

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    Combines high productivity with a compact footprint
    A new wire bonding machine featuring a brand-new platform technology


    ▎ Compact body enhances area productivity.

    ▎ Various monitoring functions enhance the reliability and stability of production.

    ▎ Reduce operating costs by decreasing electricity and high-pressure air consumption.

    ▎ Can be equipped with a variety of optional features to facilitate production line automation.

    ▎ The WE specification option provides production capacity for substrates with a maximum width of 100 mm.

     

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