- Details
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特征・特点
▎ The package position and thermistor position are measured by image processing, and position correction and installation are performed, thereby achieving high-precision assembly that can cope with small packages.
▎ High-precision measurement is achieved by adopting a digital camera and new lighting. Measurement and inspection using PFA's original image processing system contribute to improved product quality.
▎ The use of an integrated bracket and base structure and castings improves rigidity, allowing a cycle time of 0.75 seconds per unit.
▎ Equipment that enhances IoT/product quality improvement/self-diagnosis functions, such as managing the usage time and number of times main and consumable parts are used, and the usage time and number of times adhesive or solder paste is dispensed.
▎ Aggregation can be performed from the measurement data. In addition, since each camera can record up to 50 image results of past measurements, it helps to analyze defects.
Application Scenario
▎ This equipment applies adhesive or solder paste to the package of the SMD type thermistor oscillator to mount the thermistor chip.