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AFM-15

Flip Chip Bonders

Category:

PFA

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  • Details

    Features and characteristics

     

    Improve ultrasonic efficiency and enable products to be joined at low temperature and in a short time, thereby avoiding mechanical thermal residual pressure on the products and achieving stable and high-quality welding.

     

    Application Scenario

     

    Depending on the parts and products, load/ultrasonic heads can be selected and are suitable for TCXO, SAW filter, LED, C-MOS, etc.
    Wafers up to 12 inches can be processed.

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