- Details
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Combines high productivity with a compact footprint
A new wire bonding machine featuring a brand-new platform technology
▎ Compact body enhances area productivity.
▎ Various monitoring functions enhance the reliability and stability of production.
▎ Reduce operating costs by decreasing electricity and high-pressure air consumption.
▎ Can be equipped with a variety of optional features to facilitate production line automation.
▎ The WE specification option provides production capacity for substrates with a maximum width of 100 mm.
