- Details
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Features and characteristics
▎Patch accuracy is ±20μｍ (3σ) (optionally available to match ±15um (3σ))
▎UPH increased by 10% compared to previous models
▎Linear drive is used to improve the frame's conveying accuracy
▎Can correspond to lead frames up to 86mm wide and Y-welding area up to 76mm (thermal eutectic method)
▎More functions, flexible response to various components (variable parameters for wafer blue film stretching, camera focus function for chip recognition, etc.)
▎Adopt silver paste components, which can correspond to silver paste welding (double head)
▎Equipped with Universal Feeder, it can handle lead frames with a width of 100mm and a length of 300mm (dispensing method)
▎Higher accuracy and more diverse inspection functions are achieved by using a chip backside recognition camera (optional)
▎Provide process conversion kits for eutectic, WBC/DAF, silver paste, etc.
Application Scenario
Arrange neatly for connection! High-density mounting of small chips
In the IoT society where sensors are installed in all devices, it is necessary to add as many functions as possible to small and precise devices. Shinkawa has the technology to weld small chips of about 100um, and sells high-speed (maximum UPH more than 20,000) and high-precision (according to the option XY: ±15μｍ (3σ)) equipment. By
effectively using this equipment, a 150um chip can be arranged every 30um interval as shown in the figure. This equipment can correspond to chip sizes of about 3mm. Components that are mixed with EMS, RF and other modules can also be designed in small and precise devices. It is a device that plays an important role in the IoT era and occupies a place.