- Details
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Features and characteristics
▎Using Shinkawa 3D-NRS technology to achieve high precision
▎The use of dual heads improves production performance and reduces equipment space
▎Equipped with a dedicated module for sucking thin chips, it can achieve high-speed suction (400ms/chip) of chips with a thickness of 20μm (optional)
▎Equipped with a zero-friction welding head that controls both position and load, it can handle thin chip stacking products
▎Install HEPA high-efficiency filter and full-coverage stainless steel cover to adapt to the purified environment.
▎Each machine head is equipped with a chip back inspection camera. A total of 8 cameras can achieve more powerful inspection functions
▎Can handle large-size substrates with a width of 120mm and a length of 300mm
Application Scenario
For connecting, grabbing thin objects,
Pulse Vacuum Reverse Multi Step (PV-RMS)NAND flash memory, which is developing towards multi-layering, is cut to 30um thick, even with the adhesive layer. It is so thin that it is easy to bend and break. In order to bond components, the technology of grasping the chip is essential, but it is extremely difficult to handle extremely thin chips at the same time. The grasping method that cleverly utilizes the bending characteristics of components is Pulse Vacuum Reverse Multi Step (PV-RMS). By intermittently vacuuming from the outside of the sheet, the recovery force of the bent chip is utilized to promote efficient chip peeling. It is not only effective for thin chips, but also for chips with fragile Through Silicon Via (TSV) structures, and it can be said to be a key technology in the future field of electronic component bonding.
Cleaning before connecting is important.
Dust Free Cleaner (DFC)Die Attach Film (DAF), the adhesive used for NAND flash memory, is only 5um thin. Most NAND flash memories are stacked in multiple layers. When stacking new chips, if there are particles larger than 5um on the chip to be stacked, it will cause the chip to break and reduce production capacity. Therefore, cleaning before chip stacking has become an important issue.
Shinkawa immediately devoted itself to researching this topic and successfully developed a DFC unit that has a cleaning speed 60 times faster than before. While its performance has been recognized at the forefront of production sites, high-speed cleaning has helped improve production capacity.
NRS: Non Reaction
Servo SystemIn order to ensure welding accuracy and improve production capacity, it is necessary to suppress the mutual interference caused by the vibration of the drive unit. Through NRS technology, it is possible to control the vibration of the dual heads in high-speed welding and achieve high productivity while ensuring accuracy. The welding accuracy of SPA-1000 is XY: ±5 µm (3σ), θ: ±0.05 ° (3σ), and the UPH is twice that of previous equipment. Not only SPA-1000, Shinkawa's core technology is applicable to various product series.
