- Details
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Main functions of the equipment
▎High -speed 8-chip simultaneous suction/simultaneous flux dipping 13,000UPH
▎High precision ±5μm (3σ)
▎High quality, universalityFeatures
Product size
Application Scenario
● Patch process
It can simultaneously absorb and transfer 8 components at high speed, with a placement capacity of 13,000 UPH
1. Double welding heads and multiple nozzles (each welding head can be equipped with 8 nozzles)
Two welding heads are standardly equipped, and each welding head can be equipped with eight nozzles. The load can be controlled with high precision, and it can be used for mounting thin chips.
2. Double flip chip
Equipped with 2 flip heads, parallel processing is possible.
3. Multi-mode feeding device
Equipped with two feeding devices for one flip chip head, it can realize uninterrupted component supply.
High quality, strong versatility
1. High rigidity frame and beams
The high-rigidity frame developed based on thorough structural analysis and comprehensive verification tests enables the product to have both extremely high acceleration and deceleration drive and high precision characteristics.
2. Self-developed linear motor/driver
Through the specialized design, high speed and excellent positioning accuracy are achieved.
※ Example of measurement results when the axis is stopped
3. High-resolution chip recognition camera
It can precisely inspect bumps for detachment and perform position correction based on bump references, achieving high-precision placement.
4. Can maintain high precision stably
The functions of our independently developed multi-mount precision correction system MACS have been enhanced to ensure that the mounting accuracy reaches ±5μm (3σ). In addition, the newly developed thermal analysis/thermal correction processing method has been adopted to maintain high-precision mounting.
High quality, strong versatility
1. Newly developed transfer device
The thickness of the flux transfer film can be set and changed with just one click, reducing costs and saving time.
2. Nozzle station (ANC automatic nozzle replacement)
The nozzles that can be used to match component sizes from 2 to 30 mm can be automatically replaced, saving time for product switching.
3. Wafer supply device
A wafer feeder with an expansion mechanism and a θ correction mechanism is standardly equipped.
