- Details
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Features and characteristics
▎Wafer size: 8 inches, 12 inches, maximum SUS carrier Ø350mm, maximum glass panel 320x320mm
▎Equipped with upper and lower FAME to achieve high-quality full mold forming
▎ Independent control of the 4-axis servo motors allows the platen tilt to be adjusted by changing the motor parameters
▎ 8-level resin flow control to achieve high-quality WLP molding
▎Even warped wafers can be stably transferred at high speed
▎Electrostatic discharge protection (ESD protection) in wafer contact area
Application Scenario
High-quality full molding through upper and lower FAME functions
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