- Details
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Features and characteristics
▎High -precision, high-performance mounter that can handle small PKGs such as 1612/1210/1008.
▎The adoption of digital cameras and new lighting enables high-precision measurement, and PFA's original image processing system is used for measurement and inspection, contributing to improved product quality.
▎The bracket and base are integrated into a structure and cast parts to improve the rigidity, thus achieving a cycle time of 0.7 seconds per piece.
▎Equipment that strengthens IoT/product quality improvement/self-diagnosis functions, such as managing the usage time and frequency of use of main parts and consumable parts, and managing the usage time and frequency of dispensing of adhesives.
▎ Aggregation can be performed from the measurement data. In addition, since each camera can record up to 50 image results of past measurements, it is helpful to analyze defects.
Application Scenario
▎Assembly equipment that applies adhesive to the package of SMD type crystal devices and then mounts the chip.
[Supporting options]▎Double -link mechanism of dispensing unit
▎Break the chip from the crystal wafer with a size of less than 4 inches and place the chip in a package coated with adhesive.
Obtained Japanese Patent No. 4949937▎After the chip is mounted, a laser displacement meter is used to measure the height difference between the package sealing surface and the chip surface.
▎Expand target varieties.
▎Can be connected online with the cleaning and curing oven (4 carriers connected to 1 curing oven, 2 carriers connected to 1 curing oven)
