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Commodity name:
i-Cube 10 YRH10
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品名2:
Hybrid Placement Equipment
Equipment Introduction
▎Hybrid mounting realizes the mixed mounting of semiconductor components and SMD components
▎High -speed/high-precision placement ±15μm (Cpk≧1.0) CPH10,800 (when feeding wafers) ※Under our company's best conditions
▎Can support soldering pieces, Waffer Tray, Tape feeder
▎Support large substrate L330 x W250mm
Equipment Features
Feeding layout
IGBT Application Scenarios
Equipment parameters
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model
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YRH10
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Mounting head structure
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10 nozzle placement head
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Productivity
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UPH's best conditions※1
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10,800
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Wafer parts corresponding range
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Min.(mm)
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□0.35
minimum size requires actual machine evaluation
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Max.(mm)
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□16.0
Scanning camera: □12.0
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Thickness(mm)
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0.1～0.5Minimum
size requires actual machine evaluation
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Mounting accuracy
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CPK≥1.0
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±15μm
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Wafer tray placement number
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6/8 inch
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Up to 10 pieces
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Substrate size
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Min.~Max.(mm)
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L50xW30～L330xW250
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Thickness (mm)
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0.1～4.0
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