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YSM10

Compact High-Speed Modular

Category:

IGBT Mounting

YAMAHA

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  • Details

    YSM10 Equipment Introduction


     

    The same high-speed universal placement head as high-end models is adopted, and there is no need to replace the placement head. It can place ultra-small components from 03015mm (0.3×0.15mm) to large components of 55×100mm and 15mm height, covering a wide range.

     

    YSM-10 Equipment Parameters


     

    Specification

    Applicable substrate size (mm) ※Single track transport

    Single track: L50xW50-L510xW460

    Feeding operation surface

      (Single-sided component supply type)

    Theoretical capacity (cph)

    10 nozzle placement head: 46,000cph

    Number of components mounted (types) ※8mm tape conversion

    96 (48 as standard)

    Mounting height

    HM mounting head: 15mm
    FM mounting head: 15mm

    Mounting accuracy (3o)

    Absolute accuracy (μ30o) ±0.035mm
    Repeatability: (pμ30o) ±0.025mm

    Component size corresponding to the placement head

    HM mounting head: 03015~55mmx100mm
    FM mounting head: 03015~55mmx100mm

    Device dimensions (mm)

    L1,254xW1,440xH1,445

    Body weight (kg)

    Approx.1,270Kg

     

    Feeding method


     

     

    Feeding layout


     

     

    IGBT Application Scenarios


     

     

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